The lowest hierarchy of THIN are fully connected, whilst other hierarchies have
Obviously hierarchical, symmetric and scalable characteristic. The topology of THIN is very simple and the node degree is very low. This process, we can get any level THIN, as illustrated in Fig. Of level 1 THIN with lower level THIN to structure a higher one, reiterating THIN is easily scalable and the constructing process is: replacing the node The level 1 THIN is the base component to form any level THIN. A levelġ THIN can be constructed by connecting three nodes with three communicationĬhannels and then forming a triangle, as shown in Fig. 1a, we define a single node as a level 0 THIN. Particularly on decreasing the node degree, reducing the links and shortening THIN is a hierarchical and scalable interconnection network and it emphasizes With 2-D mesh from a theoretical perspective. Studied the network properties and power consumption of THIN and compared them Offers a high degree of regularity, scalability and symmetry which very wellĬonform to a modular design and implementation of NoC. Of WK-recursive topology whose basic modules are 3-node complete graph. Is a key factor to the success of NoC designs.Ī new interconnection architecture named THIN (Triple-based Hierarchical Interconnection Thus, reducing the power consumption on global interconnects
#Better than dmesh 32 bit
NoC, assuming a regular mesh topology and 32 bit link width in 0.18 um technologyĪnd minimal spacing, under 100 Mbit sec -1 pair-wise communicationĭemands, interconnects will dissipate 290W of power ( HuĮt al., 2005). The important concerns in NoC architecture design. Using a network to replace global wiring has advantages of Many research groups ( Benini and De Micheli, 2002 KumarĮt al., 2002), is expected to be an important architectural choiceįor future SoCs. Network on Chip (NoC), a new chip design paradigm concurrently proposed by Share its bandwidth and its operating frequency decreases with the system growth. The bus allows only one communication at a time, all the cores in the system Suffers from the clear bottleneck of the share media used for the transmission. With the advance of the VLSI technology, future System-on-Chip (SoC) will integrateįrom several dozens to hundreds of cores in a single billion-transistor chipĪnd the on-chip communication is soon becoming the bottleneck. Information Technology Journal, 13: 795-800. Research of Network Properties and Power Consumption on THIN. The compare results show that THIN is a better candidateįor constructing the NoC than 2-D mesh, when there are not too many nodes.īaojun Qiao, Shengbin Liang and Wei Wei, 2014. In this study, the zero-load latency and energy consumption are thoroughly studiedĪnd compared with 2-D mesh. That aims to decrease the node degree, reduce the links and shorten the diameter. Triple-based Hierarchical Interconnection Network (THIN) was proposed Latency and power efficiency are the most important concerns in NoC architectureĭesign. A new chip design paradigm called Network-on-Chip (NoC) offersĪ promising architectural choice for future System-on-Chip (SoC).
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